Product Details

Polyimde(PI) is a kind of heteroaromatic polymers,whose molecular structure containing polyimide-based monomeric unit.Its density is 1.35g/cm3,non-toxic,flame retardant,high temperature sterilization available.

Item Name	High mechanical PI plastic parts for injection parts
Material	PI or other material
Product Catologue	Plastic Spare part
Characteristic	1,Excellent mechanical properties
	2,Both high temperature resistance and low temperature resistance
	3,Great flame retardant
	4,Great wear resistance
	5,Great radiation resistance
	6,Outstanding electric insulation
	7,Chemical resistance.
Brand Name	OTEM
Size	Standard size or as customer's requirement
Manufacture method	Injection or machinery process
Packing	standard packing or customized package
Sample	similar size for test or customized samples can be offered
Lead time	10~35days
Certification	ISO9001:2008;RoHS QS9000
Payment terms	T/T , Western union
Place of Origin	Guangzhou,China
Application	Consumption of resistance/Excellent resistance to creep/Well since the embellish sex/Corrosion resistant/High temperature resistant

Applications:

1,Parts and components with low friction coefficient and wear-resistance under high-speed and high pressure;

2,Parts and components with excellent anti-creep or plastic deformation;

3,Parts and components with excellent self-lubricating and oily properties;

4,Fluid sealing parts under high temperature and high pressure;

5,Parts and components with high bending resistance,high tensile strength and high-impact performance;

6,Parts and components with corrosion-resistance,radiation-resistance,rust resistance;

7,Parts with continuous work temperature over 300°C and short term work temperature can up to 400~500°C;

8,High temperature(over 260°C)structural adhesive resistant(modified epoxy resin,modified phenolic resin,modified silicone adhesive does not exceed 260°C.)

9,Micro-electronics packaging,the protection coating of stress buffer,the lnternet layer insulate parts of multi-layer structure,dielectric films,the chip surface passivation and so on.