Specifications

Low thermal conductivity and shrinkage
Low heat storage
Excellent resistance against chemical attack
Easy to machine ,

Lower Thermal Conductivity Ceramic Fiber Board

 Ceramic Fiber Board Main Characteristic:

1.low thermal conductivity , low thermal capacity

 2.High compression strength

3..High thermal stability ,resistance to thermal shock,flame and airflow attack

4.Resistance to corrosion,high compressive strength.

5.High toughness,easy to cut and install quickly

6. Accurate dimension and good palneness;

 

 

 

 

 Ceramic Fiber Board Typical Application

1.Refractory lining for industrial furnaces

2.Combustion chamber liner, boilers and heaters

3.Back-up insulation for monolithic refractories

4.Transfer of non-ferrous metals

5.Expansion joiot boards

6.Barrier against flame

 

 Ceramic Fiber Board Technical index

Item	COM	ST	HP	HA	HZ
Specification(°c)	1100	1260	1260	1360	1430
working tem(°c)	≤1000	1050	1100	1200	1350
color	white
density(kg/m3)	280-600
rate of liner(%) (24h density320kg/m3)	-4	-3	-3	-3	-3
rate of thermal conductivity (w/m.k)(density128kg/m3)	0.085(400°c) 0.132(800°c) 0.18(1000°c)
tensile strength(mpa)	0.08-0.12

 

 Ceramic Fiber Board Chemical Composition

Chemical(%)	COM	ST	HP	HA	HZ
Al2O3	44	46	47-49	52-55	39-40
Al2O3+SiO2	96	97	99	99	--
Al2O3+SiO2+ZrO2	--	--	--	--	99
ZrO2	-	-	-	-	15-17
Fe2O3	<1.0	0.2	0.2	0.2	0.2
Na2O+K2O	≤0.5	0.2	0.2	0.2	0.2

 

Ceramic Fiber Board Factory picture