Product Details

Specifications

Silicon Carbide
1.For grinding wheels
2.heating elements
ated tools

Silicon Carbide For Abrasives and Refractory

1.Green, crystal structure, high hardness and strong cutting ability, stable chemical characteristics, good thermal conductivity.

2.Among abrasives, silicon carbide’s hardness is higher than corundum, and ranked below diamond, CBN and boron carbide.

3.Density generally viewed is 3.20−3.25g/ mm3 , natural bulk density is 1.2−1.6g/ mm3 , specific gravity is 3.20˜3.25g/ mm3.

Raw material are petroleum coke and quality silicon sand, appended with salt, then smelted in electric arc furnace. Mechanical strength is higher than corundum.

Particle size comparison of commonly used abrasive:

	Particle size distribution (micron)			Chemical composition			Physical composition
Size	D3	D50	D94	SiC ≥(%)	Fe2O3 ≤(%)	F•C ≤(%)	PH Value	Bulk Density	Magnetic Materials≤(%)
GC#800	≤20.0	14.0±1.0	≥9.0	99.00	0.20	0.2	6--8	1.18	0.008
GC#1000	≤18.3	11.5±1.0	≥7.0	98.50	0.20	0.2	6--8	1.15	0.008
GC#1200	≤17.5	9.5±0.8	≥5.5	98.50	0.20	0.2	6--8	1.13	0.005
GC#1500	≤14.5	8.0±0.6	≥4.5	98.00	0.20	0.2	6--8	1.12	0.005
GC#1800	≤13.5	7.0±0.6	≥4.2	98.00	0.20	0.2	6--8	1.05	0.005
GC#2000	≤13.0	6.7±0.6	≥4.0	98.00	0.20	0.2	6--8	1.00	0.005

Main applications:

solar and semiconductor wafer wire sawing; crystal and ferrite polishing; ceramic and special steel precision polishing; bonded and coated abrasive tools; cutting and polishing; non−ferrous metal lapping such as glass, stone, agate and high−grade jewelry; high−grade refractory materials , engineering ceramic, heating elements and thermal elements.

For wire-sawing of solar and semi-conductor

Usage:

Green silicon carbide is used for wire−sawing of monocrystal silicon, polocrystalline silicon, potassium arsenide, quartz crystal etc, it is the engineering processing material in solar photovoltaic industry, semi−conductor industry and piezoelectric crystal industry.

Feature:

1.high purity and large crystal silicon carbide ingots ensure the excellent cutting capability and stable physical condition.

2.Grains are isometric with sharp edge, which ensure the even self-sharpening capability as cutting material and minimum TTV of the products been cutted.

3.Particle size distribution is narrow and even.

4.High heat−resisting and refractoriness under load guarantee the small wire expansion in processing, suitable to all kinds of wire saw machine.

5.Grain surface possessed specially, micro−powder with clean surface and easily fit cutting fluid, such as polyethyleneglycol and so on.