Specifications

Thick Film Resistor Networks (Array) (SIP)
- High Reliability
- High Stability
- Minature, High Density Package
- Precision

Thick Film Resistor Networks (Array) (SIP), D Type

• Substrate: 96% a aluminum provides superior thermal properties and cooler operation
• Resistors and Conductors: thick film materials with proven reliable performance
• Terminals: clamped and soldered to substrate to ensure mechanical and electrical integrity. Solder coated copper alloy provides high electrical conductivity and thermal transfer. Good performance in D.I water cleanliness
• High Temperature Solder: used to prevent reflow under printed circuit board assembly operations
• Conformal coating: is applied over an organic primary protection undercoat to isolate network elements from physical and environmental hazards and to ensure reliable performance
• Date Codes: are provided on all devices for lot tractability. (except for 4 pin)

Characteristic

Circuit Structure

How to Order