• Excellent heating material produces precise controled temperatures
• Movable heating head, able to move horizontally, easy to operate
• Touch screen interface, PLC control; real-time temperature profile display
• Powerful cross flow can cool the lower heating area rapidly
• Different hot gas nozzles, easy to replace
• Adjustable PCB positioning supports, easy and fast to install PCB
• The BGA soldering supporting frame can micro-adjusted to avoid local sinkage
• 8 segments of temperature control, profile analysis can be carried out on the touch screen
• Temperature alarming and protection function for both upper and lower heating area
• Alarming function for finishing soldering or desoldering; hand vacuum pen easy for picking up BGA 
• 

Heating system: Three independent temperature zones, (top hot air heating, under hot-air heating, and bottom IR heating),

 temperature and time can be displayed digitally on the touch screen, able to rework CGA

Vacuum removal system: The system carries vacuum pen , built-in vacuum pump, suction appropriate, easy to operate,

also can protect the pins on PCB from  being damaged