High-performance BGA rework station RW-SV550

Specification:

<img src="/img/pb/270/536/389/389536270_678.jpg" alt="7.jpg"> 

Features: *Hot air heater head and mounting head are designed 2 in 1, driven by step electric motor, have both the auto soldering and mounting function; *Three heaters( upper/lower hot air heater, bottom IR heater) heating independently, time and temperature can be displayed digitally on touch screen; *Upper heater is movable, convenient for operation; *Large movable bottom IR heating area, PCB clamps can be adjusted along with X& Y table flexibly, the max PCB size it can handle up to 550×500mm; *Powerful cross flow fans cool the bottom heating area rapidly with stable speed. *Color optical system with functions of split vision, zoom in/out and micro-adjust, equipped with aberration detection device; with auto focus and software operation function, 27 X optical focus, able to rework BGA sized up to 70×70mm; * Embedded industrial computer, touch screen interface, PLC control, real-time profile display, able to display set profile and 5 practically tested profile at the same time; can analyze the five practically-tested profiles, and compare them with the history saved profiles; *Color LCD monitor; big size screen, easy to operate; Connect USB mouse, easy to operate *Built-in vacuum pump; 60 °rotation in φ angle, mounting nozzle is micro-adjustable; *8 segments of temperature up(down) and 8 segments constant temperature control, profile saving is unlimited in the industrial computer; *Suction nozzle can identify material and mounting height automatically, and can

control the air pressure within a small range; *Equipped with different hot air nozzles, easy to replace and able to locate in any angle; *Can handle 775 socket, 478 socket, XBOX360, PS2/3 CISCO Sever etc.