Specifications
1.low profile2.SMT
3.ROHS
Features
1. 4.8x4.8mm dimensions with 0.55mm height ,suitable for high density mounting.
2. contribute to downsizing and lighter weight of application devices
3. reflow solderable
Applications
For operaing various devices such as mobile phones ,communication devices,video recorders,cameras and audio devices that reqiuire lowprofile and lightweight design.
mobile phone
Specification
Diagram