Specifications
1.horizontal push2.mini type
3.SMD
4.ROHS
Features
1.Improve mounting density of components on PC board.
2.Reflow solderable.
3.Contacts are completely sealed ,enhancing reliability.
.
Applications
1.For operating various mobile devices.
2.For operating various devices that require high density mounting such as mobile phones ,communication devices,compact electronic devices.
Specification
Diagram