Specifications

silicon wafer laser scribing machine
High scanning speed and precision.
Imported core parts
Woking for a long time
CE ISO

solar cell laser cutter silicon wafer laser scribing machine

 

Key Features:

1*.Imported high quality semiconductor laser diode pumped Nd: YAG

 

2*.High quality laser beam mode(10000 hours), high lightning conversion  efficiency.

 

3*.Low power consumption, cost effective and long lifespan, convenient to maintenance.

 

4*.Sturdy and compact structure. HP-26 running stability with high safety. Mainly used for metal, alloy and oxide, ABS resin, ink ,electronic components, jewelry, auto parts, telecommunication products, plastic keys, integrated circuit (IC) industry.

 

5*.Easy to install and operation, marking accuracy is good.

 

6*.Integrated marking software with user-friendly design.

 

7*.Various connection mode for optimzing to achieve automaically marking.

 

8*.Versatile marking software is compatible with Coreldraw,AutoCAD,Photoshop.

 

9*.Support PLT, DXF, BMP, PCX, JPG, common vector and bitmap graphics, date marking  supporting, serial number, bar code, 2D code, incrementing serial No., automatic jump codes, etc.

 

10*.Excellent for long-lasting operation. 

 

Technology Parameters 

Model	silicon wafer laser scribing machine  XTL-DP75
Laser power	75W
Laser wavelength	1064nm
Cooling way	Water cooling
Beam quality	m2<6
Laser repetition frequency	≤50KHz
Standard marking area	110mm x 110mm
Optional marking area	150mm x 150mm
Marking depth	≤0.3mm
	The depth is adjustable according to different materials
Linear speed	≤7000mm/s
Min. Line width	0.02mm
Min. letter	0.25mm
Repeatable accuracy	±0.001mm
Software supported	CorelDraw, AutoCAD, Photoshop etc
Gross power	≤2.5KW
Electricity source	220V/50Hz /15A

 

Guarantee

1.One year quality guaranty, the semiconductor laser marking machine with main parts shall be changed free of charge when problems happened during the warranty period.

2.Lifetime maintenance free of charge.

3.Free training course at our plant.

4.We will provide the consumable parts at an agency price when you need replacement.

5.12 hours on line service each day, free technical support.

6.Machine has been adjusted before delivery , operation disk was included.

 

 

Application Field 

Electronic component, IC chips , panels, measuring tools, all kinds of mechanicao parts,hardware tools, dials and  other carbide materials

 

 

silicon wafer laser scribing machine samples

 

 

   silicon wafer laser scribing machine marking photos

 

 

 

Certifications

silicon wafer laser scribing machine  has been approved by CE/ISO

 

 

 

 

 

About Us

Jinan Xintian Technology Co.,Ltd is professional manufacturer of laser equipment, established in 2004. 

It is a professional manufacturer engaged in the research,development, production and service of  

Diode pumped Laser marking machine, Fiber laser marking machine,CO2 laser marking machine,Pneumatic marking machine,Laser engraving machine,Laser welding machine, Laser cutting machine and Laser trimming machine

 

 

Other Types of  Laser Marking Machine 

Except for  silicon wafer laser scribing machine , we also offer you : Fiber laser making machine, Pneumatic marking machine, CO2 RF laser marking machine

 

 

Packaging and Delivery 

 

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