Specifications

Lead-free HAL PCB Board, .PCB certificate:ISO, UL and ROHS

1. Layers: 2-20 layers

2. Max. Board size:2000x610mm

3. Min. board Thickness : 2-layer 0.15mm

4-layer 0.38mm 6-layer 0.55mm 8-layer 0.80mm 10-layer 1.0mm 4. Min. line Width/Space: 0.075mm(3mil)

5. Max. Copper thickness:

6OZ 6. Min. S/M Pitch: 0.075mm(3mil)

7. Min. hole size: 0.1mm(4mil)

8. Hole dia. Tolerance (NPTH): +0/-0.05mm(2mil)

9. Hole position deviation: +0.05mm(2mil)

10. Outline tolerance: +0.10mm(4mil)

11. Twist & Bent: 0.75%

12. Insulation Resistance: >1012 Ω Normal

13. Electric strength: >1.3kv/mm

14. S/M abrasion: >6H

15. Thermal stress:288°C 20Sec

16. Test Voltage: 50-300V

17. Min. blind/buried via: 0.15mm (6mil)

18. Surface Finished: HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold

19. Materials:FR4, H-TG, Teflon, Rogers, Ceramics, Aluminium, Copper base