Product Details

Specifications

pcb development board from Shenzhen Rigao;
No MOQ;
OEM SMT&DIP Service;
1-22 Layer;
UL.ROSH SGS Certification.

Welcome To Rigao Electronics

pcb development board from Shenzhen Rigao

- Contract Manufacturing
- Engineering Services
- PCB Design & Assembly and copy service
- Prototyping

- Components purchasing

- Cable and Wire Assemblies
- Plastics and Molds

- Fast turn around

1. Double-Sided FR4 material 1 oz copper pcb board
2. Green solder mask, Immersion gold
3. with Competitive price

General Specifications Capability

Material Requirements:

Size	Max.Finshed Size	20.9”x24.4”(530mm x 620mm )
Board Thickness	Standard	0.004”to0.16 ” ±10% ( 0.1mmto4.0mm±10% )
	Min.	Single/ Double-sided:0.008”±0.004”(0.2mm ±0.1mm)
		4-layer:0.01”±0.008”(0.4mm ±0.1mm)
		8-layer :0.01”±0.008”(0.4mm ±0.1mm)
	Bow and twist	< 7/1000
Copper Weight	Outer Cu weight	0.5oz ~ 3.0oz
Copper Weight	Inner Cu wight	0.5oz ~ 3.0oz
Laminate Materials	FR-4,FR-1,,FR-2,CEM-1,CEM-3

Process Requirements:

Solder Mask	Color	green,light green,white,black,dark brown,yellow,red,blue
	Min. solder mask clearance	0.003”(0.07mm)
	Thickness	0.0005”-0.0007”(0.012mm-0.017mm)
Silkscreen	Color	White,black,yellow,red,blue,green
Silkscreen	Min. Size	0.006”(0.15mm)
Surface Finish	HASL,HASL pb free,immersion gold,immersion silver,immersion tin,O.S.P (Entek),S/G plating,ENEPIG,G/F plating,carbon

Quality Control:

Electrical testing	Flying Probe Tester	Y
Controlled Impedance	Tolerance	±10%
Controlled Impedance	Impedance tester	Tektronix TDS8200
Routing	End Mills Test	± 0.006”(0.15mm)
	CNC Tolerance	±0.004”(0.1mm)
	V-Cut Depth V-cut	FR-4(1/3+-0.1mm);FR-1,FR-2,CEM-1,CEM-3(1/2+-0.1mm)
	V-cut angle V-CUT	15°,18°,30°
	V-CUT	line,hole,V-shape

Certificates

UL Cert.	Y
ISO Cert.	ISO9001 :2008
TS16949	Y
ISO14000	Y

Manufacturing Capability for PCB Board

1). Material type: CEM-3,FR-4,FR-4-TG170/TG180,Halogen Free,Rogers,Arlon,Taconic,Isola,PTFE, Bergquist

2). Surface Treatment: HASL,HASL lead-free,HAL,Flash gold,immersion gold,OSP,Gold Finger Palting,Selective thick gold plating, immersion silver,immersion tin, Carbon ink,peelable mask

3). Solder mask colour: Green/MATT Green/Blue/Yello/White/Black/Red

4). Board Size: 650mm*1000mm

5). Board Layer: 1L-26L

6). Board thickness: 0.2mm to 6.0mm

7). Finished Copper thickness: 0.5 OZ to 6 OZ

8). Min. drilled hole size: 3mil (0.075mm)

9). Min. Line width/Line spacing: 3mil/3mil

10). Copper thickness in hole: >20um

11). Board thickness tolerance: ±10%

12). Outline tolerance: Routing:±0.1mm,Punching:±0.1mm

13). Hole tolerance: PTH: ±0.076mm , NPTH: ±0.05mm

14). impedance control tolerance: ±10%