• Touch screen with human interface,heating time,heating temperature,reflow temperature rate,advanced alarming,vacuum time all can set inside the touch screen,simple operation,easy learn. auto bga chip removal machine

• PLC import from Japan,temperature control module use China famous brand,display three temperature curves,4pcs independent temperature sensor,which can measure the different place temperature of the chips,make sure the rework rate

• Three independent heating temperature zone,each heating temperature zone can independently set the heating temperature ,heating time,rate;six heating temperature sections,Simulate the reflow oven heating mode [preheating,constant,warming, soldering,reflow soldering,cooling]  zm-r720

• Auto feed chips,pick up chips,blowing chips;auto recognition chips place during alignment Multifunction mode [weld,remove,mount,manual],realize semi auto and auto function ,meet customer’s requirement.  auto bga chip removal machine

• High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1℃

• Imported optical alignment system with 15’’high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.

• Top heater and mounting heater design2 in 1 which can make the mounting more precision;there are many sizes of BGA nozzles which can meet different chips sizes,BGA nozzles can easy change,we accept customize.zm-750

• High automatic and precision,Completely avoid human operation error; it is good for reworking lead free craft and double BGA,QFN,QFP,capacitance-type resistor components which can achieve good result. auto bga chip removal machine

• Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function )

Power

6800W

Up heater power

1200W

Down heater power

1200W

IR heater power

4200W(2400W control)

Power supply

(Single Phase)  AC 220V±10 50Hz

Position way

Optical lens+ Vshape holder+laser positioning

Temperature control

High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±1℃

Material

High sensitive touch screen+temperature control module+PLC+step drive

PCB Size

Max:500×450mm

PCB Size

Min: 10×10mm

Thermo-couple Ports

4pcs

Chips magnification times

2-30

PCB thickness

0.5-8mm

BGA size

0.8mm-8cm

Min.chips pitch

0.15mm

Mounting BGA weight

1000G

Mounting precision

±0.01mm

Size

L670×W780×H850mm

Optical alignment lens

Motor drive can move front back right left

Weight

About 90kg auto bga chip removal machine