Silver content:10-15%( HP15)

Apparent density:0.85-0.91 g/cm³

Surface area:2.11m²/g 

D90:11um,D50:8um,D10:5um 

Microscopic morphology: flake 

Silver content:15-17%( HS17)

Apparent density:1.02-1.1 g/cm³

Surface area:1.04m²/g

D90:7um,D50:4um,D10:2um

Microscopic morphology: flake

Silver content:20-25%( HP25)  

Apparent density:0.85-0.91 g/cm³ 

Surface area:2.21m²/g    

D90:12um,D50:8um,D10:6um 

Microscopic morphology: flake  

Silver content:20-25%( HS25-1)

Apparent density:1.15-1.01g/cm³

Surface area:1.43 m²/g

D90:10um,D50:5um,D10:3um

Microscopic morphology: flake

Silver content:20-25%( HS25-2)

Apparent density:1.05-1.11g/cm³ 

Surface area:1.23 m²/g

D90:10um,D50:5um,D10:3um

Microscopic morphology: flake  

Silver content:25-27%( HS27-3)

Apparent density:1.02-1.1g/cm³

Surface area:1.04 m²/g

D90:7um,D50:4um,D10:2um

Microscopic morphology: flake

Silver content:30-35%(HP35)       

Apparent density:0.82-0.85 g/cm³

Surface area:2.34m²/g

D90:7um,D50:5um,D10:3um

Microscopic morphology: flake

Silver content:10% ,20% ,30%,50%

Apparent density:1.56 g/cm³ 

Surface area:1.34 m²/g

Particle size :45um

Microscopic morphology: spherical

Silver content:10% ,20% ,30%,50%

Apparent density:1.56 g/cm³ 

Surface area:1.34 m²/g

Particle size :45um

Microscopic morphology: dendritic

Use

1.used as a good conductive material, good conductivity silver coated copper powder for electromagnetic shielding is widely used in electronic,electromechanic,communication,printing, aerospace,weapons etc. industry.

2.it can be used as high-efficiency catalysts .

3.it also widely used as conductive adhesive.

4.it widely used in conductive ink.

5.it also often used in silk-screen printing.

6.recessive materials.

7.inorganic antiseptic material

nductive coating paint and static conductive paint

9.electroconductive rubber

10.electroconductive plastics

Features

silver coated copper powder for electromagnetic shielding has good electrical conductivity ,has high chemical stability , is not easy to be oxided ,quality is stable , is very stable .

Silver coated copper powder is to adopt advanced technology of electroless plating, through a specific molding and surface treatment technology, forming a different thickness of silver coating in the surface of ultrafine copper powder .It overcomes the easy oxidation of copper powder .It has good electrical conductivity, high chemical stability, not easy oxidation, low price, is a very promising a highly conductive filler .

HS CODE

7406209000

CAS no

7440-50-8

Making method

Shape

flake , dendritic, spherical

Remark:We can produce the product according to customer's requirements .