Main Products: Lead Free Reflow Ovens ,Dual Wave Soldering Machines ,SMT Screen Printers
Desktop Lead Free Wave Soldering machine
Negotiable /Set
Min.Order:1 Set
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Business Type: ManufacturerMain Products: Lead Free Reflow Ovens ,Dual Wave Soldering Machines ,SMT Screen PrintersProduct Details
Technical specifications ( Foam type )
| Max power consumption | 6Kw |
| Solder pot capacity | 85Kg |
| PCB width (L×W)(mm) | 350 X 350 mm (Max) |
| Solder temperature range | Room~350 degrees |
| Preheat Temperature range | Room~200 degrees |
| Wave height adjust range | 5~ 12mm |
| Melt time | 60min |
| Fluxer | Foam ( Internal Air Pump ) |
| Power supply | Single phase 220V/240V, 50/60HZ |
| Conveyor speed | 0.5~ 1.6 m /min |
| Dimension | 1230 X 800 X 600mm |
| Weight | Approx 175 Kg without alloy |
| Packing | Exemption wooden box and vacuum packaging |
| Packing size | L1400 * W950 * H770mm |
Technical specifications ( Spray type )
| Max power consumption | 6Kw |
| Solder pot capacity | 85Kg |
| PCB width (L×W)(mm) | 350 X 350 mm (Max) |
| Solder temperature range | Room~350 degrees |
| Preheat Temperature range | Room~200 degrees |
| Wave height adjust range | 5~ 12mm |
| Melt time | 60min |
| Fluxer | Spray fluxer ( Internal Air Pump ) |
| Power supply | Single phase 220V/240V, 50/60HZ |
| Conveyor speed | 0.5~ 1.6 m /min |
| Dimension | 1650 X 830 X 680mm (no include lighthouse and flux bucket) |
| Weight | Approx 205 Kg without alloy |
| Packing | Exemption wooden box and vacuum packaging |
| Packing size | L1800 * W1000 * H850mm |
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