Specifications

Specifications and technical parameters:

ZM-R5860C Main Features:

1. Adopt liner slide which makes X,Y,Z axis all can do precision adjustment or fast positioning, with high positioning accuracy and fast maneuverability.
2. High definition touch screen (Taiwan) , PCL control, can save multiple groups profile, password protection and modify function, and can save multiple groups profile, equipped with instant temperature curve analysis function.
3. There are 3 independent heating areas from top to bottom. The 1st and 2nd are hot-air heaters, the 3rd is IR preheating, temperature controlled within plus-minus 3 degree. Top heater can be adjusted freely, second heater can be adjusted up and down, and the top and the bottom temperature can control many groups and sections of temperature parameters at the same time. The power consumption of the third IR heater can be adjusted.
4. Offer all kinds of hot-air nozzle, it can rotate 360 degree. With magnet, easy to install and change, customized is available. Bottom IR heater ensure an even heat for PCB board.
5. Choose imported high-precision K-type thermocouple, closed loop control and automatic temperature compensation system, combined PLC module for the precision control of temperature.
6. Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled, and it can rework for any BGA package size.
7. Powerful cross-flow fan rapidly cool the PCB board to improve efficiency. Also built-in vacuum pump and external vacuum suction pen, pick up the chips rapidly.
8. After finish desoldering & soldering, there is an alarming and alarming in advance.
9. CE certificate, with emergency stop and Automatic power-off protection device when abnormal accident happens, with a double over-heating protection control.
10. CCD vision system, accurate judgments on the melting process during the BGA soldering and desoldering, provide critical vision.