Product Details

220v SP 360C IR Heating PLC Control BGA repair Rework system equipment,SP360C bga soldering Machine

Place of Origin Guangdong, China
Brand Name Shuttle
Model Number SP360c
Voltage 220V
Rated Capacity 4000W
Dimensions 650*500*600mm
Weight 60KG
Usage Repair XBOX,PS3,desktap,notebook...
Certification CE

Product Features

Specifications

1)Set with over temperature alarming and protection function
2)Powerful cross flow can cool the lower heating area

220v SP 360C IR Heating PLC Control BGA repair Rework system equipment,SP360C bga soldering Machine220v SP 360C IR Heating PLC Control BGA repair Rework system equipment,SP360C bga soldering Machine

 

 

Description

 

SP 360C IR Heating PLC Control BGA repair Rework Station,SP360C bga soldering Machine

*  High quality heating material produces high-tem breeze, precisely controlling the soldering and desoldering process.

* Movable heating head, able to move horizontally; easy to operate;

*  Embedded industrial computer, touch screen interface, PLC control; real-time temperature curve display, able to display set curve and practically-tested curve; 7.2 high definition screen, convenient for operation and observation;

*  Industrial computer able to store unlimited temperature curves, curve analysis can be done on touch screen; both English and Chinese can be input;

*  The temperatures of the upper and lower heater can be precisely controlled according to set temperatures; bottom constant temperature infrared heating area; appropriate temperature control apparatus can ensure safe rework for BGA;

*  The BGA soldering supporting frame can micro-adjusted to avoid local sinkage;

*   Powerful cross flow can cool the lower heating area;

*  The adjustable PCB positioning supports, easy and fast to install PCB; special fixture for installing allotype boards ;

*  with sound alarming function after finishing soldering or desoldering; hand vacuum pen easy for picking up BGA;

*  Set with over temperature alarming and protection function;

*  Equipped with different hot gas nozzles, easy to replace; can be customized according to specific needs;

*  The integrated design of machine and chassis is room-saving.

 

Applicable PCB size

 Max PCB size: 430mmX350mm

Applicable BGA size

 Max size: 55mmX55mm

 Min size: 7mmX7mm

Max weight: 80g

Power for operation: 3600W

Main heater: 800W

Lower heater: 800W

Bottom heater: 2400W

 

Machine dimension: 650*500*600mm

Machine weight: 36KG

Input power: AC 220V 3.6KW

----------------------------------------------------------------------Package list :

1.  BGA rework station RW SP-360C--------------1 PCS

Accessories :

Nozzles -------------------------------------------------5 pcs (44, 41, 38, 31, 26 mm,  1pc for each size)
Tools box -----------------------------------------------1 pcs
Inside the hexangular wrench ---------------------1 set
Clamp for Motherbord--------------------------------1 set
Brush----------------------------------------------------1 pcs
USB mouse --------------------------------------------1 pcs
Vacumm IC pikcer-------------------------------------1 pcs
Aluminium plate for BGA IC reballing --------------1 pcs
Thermo sensor wire(High precision) ---------------1 pcs
Reballing stencils holder -----------------------------1 pcs
Reballing stencils --------------------------------------33 pcs
0.5 /0.6/0.76mm leaded solder balls---------------3 bottles (1 bottle for each size , 250k/bottle)
English manual ------------------------------------------1 book

 

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