Product Details

Specifications

Low Melt Polyamide Resin Hot Melt Adhesive:
Excellent adhesion
laundry&dry cleaning resistance
solvent resistance

Low Melt Polyamide Resin Hot Melt Adhesive Technical Data Sheet

update: 2012.03.23

Reference Product properties		HT-8115
Appearance Form		Granule
Components		COPA(Copolyamide)
Optical Brightener Additives		Yes
Melting range DSC (°C)		90-100
Melt-index (g/10min) (160°C/21.18N)		25-35
Density (g/cm³)		1.1
Specifications	Granule	Φ(3-4)×(5-6)mm





Bonding condition (for reference only)	Temperature (°C)	110-130
	Press (kg/cm²)	1.5-2.0
	Time (S)	10-15
Laundry resistance	40°C	excellent
	60°C	satisfactory

Dry-cleaning resistance		excellent

The characteristic and application of COPA granule:

The melting range is within a small range, good adhesion, excellent laundry resistance, solvent resistance and instant solidifying etc. The appearance of the granule is near clear and well-proportioned. It is user - friendly and convenient.

Application fields: garment, reflective materials, automotive and leather industries.

Factory:

R&D:

Deep cold pulverization:

Certification:

Exhibition: