Product Details

FR4 material power bank pcb board

Place of Origin Guangdong, China
Brand Name Eastwin
Model Number EW30419Y164
Base Material FR-4
Copper Thickness 1oz
Board Thickness 1.6mm
Min. Hole Size 0.1mm
Min. Line Width 0.1mm
Min. Line Spacing 0.1mm
Surface Finishing HASL

Product Features

Specifications

1. power bank pcb board
2.UL&RoHS Approval,100%E-tested
3.OEM&OEM fr4 pcb board
4.High quality with competitive price

 

FR4 material power bank pcb  board

 

Welcome to Eastwin!

 

PCB process capability:
1.Layer:  2-22 layer
2.Product type:  Rigid PCB,High Density Inverter PCB,thick copper PCB
3.Materials:  FR-4, CEM-3, Teflon, Aluminum Substrate, Rogers, Halogen Free, High Tg
4.Copper Thickness:  140micron(4oz)
5.Min Board Thickness:  0.4mm
6.Max Board Thickness:  5.0mm
7.Min finished Hole Diameter:  0.1mm
8.Outer layer line width / spacing:  0.1mm/0.1mm
9.Inner layer line width / spacing:  0.1mm/0.1mm
10.Min aperture:   0.2mm
11.Min Laser drilling:  0.1mm
12.Min  Ring Width:  0.11mm
13.Min BGA-bit hole spacing:  0.4mm
14.Resistance Tolerance:  ±10%
15.Minimum Insulation Thickness:  3mil
16.Maximum laser blind hole thickness to diameter ratio:  0.8:1
17.Maximum working board size:  520*622mm
18.Drilling Tolerance (PTH):  ±0.075mm
19.Drilling tolerance (NPTH):  ±0.05mm
20.Outline Tolerance (CNC):  ±0.13mm
21.Surface coating:  Lead Free HAL, HAL, Flash Gold, Immersion Gold, Immersion Tin, Immersion Silver, OSP, Gold Finger Plating, Carbon Ink Printing, Peelable Blue Mask

 

 

 

Your single point of contact for all of your raw materials, parts, and pcb assembly,  also offers:
 - Contract Manufacturing
- Engineering Services
- PCB Design & Assembly
- Product Design
- Prototyping
- Cable and Wire Assemblies
- Plastics and Molds

 

 

 

Detailed Terms for Pcb Assembly

 

 

 

 Technical requirement:
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.

 

 

 

 Quote requirement:
1)Gerber file and Bom list
2)Clear pics of pcba or pcba sample for us
3)Test method for PCBA

 

 

 

Factory View:

 

FR4 material power bank pcb board

 

All of the above description is to demonstrate the ability of our factory, if you have specific requirements, please contact us!

 

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