Specifications

1.PCB Reverse engineering China &PCB Manufacturing
2.High quality,competitive price
3.X-ray&AOI,function test
4.UL,SGS,Rohs

PCB Reverse engineering China &PCB Manufacturing

  

Welcome to Eastwin!

 

Our PCB board manufacture and PCBA service

* PCB board file with parts list provided by customers

* PCB board made, circuit board parts purchased by us

* PCB board with parts assembled

* Electronic testing circuit board or PCBA

* Fast delivery, anti-static package

* RoHS Directive-compliant, lead-free

* One stop service for PCB design, PCB layout, PCB manufacture, components purchasing, PCB assembly, test, packing and PCB delivery

 

PCB process capability:

Item		Parameter
		Double sided	Multilayer
Number of Layers		2	4~16
Copper Thickness		0.25~3.0OZ	0.5~3.0OZ
Base Board Thickness		0.3~3.2mm	0.6~3.2mm
Incombustibility		94V-0	94V-0
Peelable resistance		12.3N/cm	12.3N/cm
Twist		≤0.5%	≤0.5%
Insulation resistance		≥1011Ω	≥1011Ω
Test voltage		10-300V	10-300V
Finished board area		560×970mm	560×970mm
Min. Line Width and Spacing		0.1/0.1mm	0.1/0.1mm
Copper thickness in hole		≥25.0um	≥25.0um
Mini. pad diameter	Inner layer		0.05mm
	Out layer	0.076mm	0.076mm
Mini. Hole Diameter		0.25mm	0.20mm
Hole tolerance	PTH	±0.076mm	±0.076mm
	NPTH	±0.05mm	±0.05mm
Hole location tolerance		±0.076mm	±0.05mm
profile tolerance	Routing	±0.1mm	±0.1mm
	Punching	±0.13mm	±0.13mm
Solder mask bridge ability		≥0.1mm	≥0.075mm
Solder mask rigidity		6H	6H
Solderable test		245 Degrees Centigrade     5 second	245 Degrees Centigrade     5 second
Thermal cycling ability		288 Degrees Centigrade   10 second	288 Degrees Centigrade    10 second
Surface Finishing		OSP, HAL, Immersion gold , Gold plating, Rosin, Gold finger	OSP, HAL, Immersion gold , Gold plating, Rosin, Gold finger

 

Detailed Terms for Pcb Assembly

 Technical requirement:
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.

 Quote requirement:
1)Gerber file and Bom list
2)Clear pics of pcba or pcba sample for us
3)Test method for PCBA