TAIAN PUHUI T-961 reflow soldering machine, led soldering, BGA reflow,six tempreture zone
USD $1 - $1,300 /Set
Min.Order:1 Set
Taian Puhui Electric Technology Co., Ltd.
TAIAN PUHUI T-961 reflow soldering machine, reflow soldering oven, led soldering, BGA reflow
Technical parameters
Model | T-961 |
The heating zone quantity | upper3/down3 |
The length of the heating zone | 730mm |
The heating type | IR and hot air heating |
The cooling zone quantity | 1 |
Maximum width of PCB board | 230mm |
The operation direction | left→right |
Delivery options | Net transmission+chain transmission |
The speed of conveyer belt | 0-290mm/min |
The power supply | 220V 50/60Hz |
Peak power | 3.5KW |
Heating up time | Around 7mins |
Temperature control range | Room temperature~300℃ |
Temperature control mode | PID closed-loop control |
Temperature control accuracy | ±1℃ |
PCB temperature distribution deviation | ±2℃ |
Overall dimensions | 1000×466×445mm |
Machine weight | 70KG |
Operating Instructions
1,Enter into the setting interface when starts the machine.(temperature zones from left to right 1/upper 3/upper 5/upper , 2/down 4/down6/down;face the swift of machine,(temperature zones from left to right1/upper 3/upper 5/upper , 2/down 4/down6/down).
2, Rotate Param button slowly to move the white cursor, when button move counterclockwise,white cursor up. When white cursor refers to the parameters need changed, slowly rotate value key to change parameter, when rotating value key clockwise ,the parameter bigger,when rotating value key counterclockwise, the parameter shrunk. The SPD is belt transmission speed setting, PRFV is wave number set.
3, After the parameters changed, press the value button for long time, until the screen reads “successfully”,parameters saved successfully.
4, Press param button long time to enter work interface, the oven start to run the wave.
5,Press param button long time to return to setting interface to re-set other waves.
6,After the wave set, only need to change the wave number of PRFV then select the wave.
7,Six small red switch, control the six tempreture zone lamp.
8, Attentions:
Each temperature wave purposes as follows:
Wave one and two: use the same with soldering the less lead paste, like 85Sn/15Pb 70Sn/30Pb
Wave three and four: use the same with soldering the more lead paste, like 63Sn/37Pb 60Sn/40Pb.
Wave five and six: use the same with soldering high-melting-point Warm prompt: the machine after shutdown, if you want to restart, the interval of at least 5 s
Wave seven and eight: use the same with soldering lead-free solder in melting point, like Sn/Ag2.5/Cu.8/Sb.5;Sn/Bi3.0/Ag3.0
2. There are lot kinds of solder paste, every company chooses is also not identical. For these reasons, we design this product can set eight waves, each wave has three sections, each section of the heating time and temperature all can alter. You can reset the heating waves according to the solder required heating temperature and time.
Warm prompt: the machine after shutdown, if you want to restart, the interval at least 5 s
When the PCB board goes into heat up area (dry area), the solvent and gas in the solder paste will evaporate. At the same time, the flux can wet the pad and the component tip and foot. The solder paste melts, caves in and covers the pad, leading to the pad and component pins insulate the oxygen. PCB board goes into heat preservation area. PCB board and components get full preheating. In case of damaging the PCB and components when it goes into the welding area and the temperature heats up quickly. When PCB board goes into the welding area, the temperature heats up and the solder paste melts. When PCB board goes in to cooling area, the liquid solder paste the soldering points solidify. The reflow process is finished.
The temperature is the key to welding quality. The actual and the setting temperature warming slope and the peak temperature should be accordant. Before the temperature reaches 160℃, please control the heat up speed in about 1℃/S. If heat up too quickly, the PCB board and the components will be damaged, and the PCB board may be out of shape. On the other side, the flux volatilizes too fast. And it is easy to make soldering tin ball. Set the peak temperature 20℃-40℃ higher than the solder paste melting point. Set the reflow time 10S-60S. If the peak temperature is low or the reflow time is short, it will affect the welding quality, and serious is causing the solder paste does not melt. If the peak temperature is high or the reflow time is long, the metal power will be oxidized and affect the welding quality and serious is causing the component and PCB board damaged.
Set the wave according to the solder paste and the above foundation. Different solder paste, choose and set different waves. In addition, the temperature wave has related to the PCB, the density and size of components. Generally lead-free welding temperature should be higher 40℃ than melting point.
1. Set the temperature and belt speed to initial value(usually the manufacturer supply when adjust)
2. To the cooling oven, should be preheated for 20-30 minutes.
3. When the temperature is stable, let PCB board pass heat reflow system. Under this set, the solder paste can reach the reflow critical point. If there isno reflow, to operate as step 4. If the reflow is too fast, please keep correctproportion to increase or reduce the temperature. And let the PCB pass the system again until reach the reflow critical point. Then turn to step 4, only when there is reflow that is good.
4. If there is no reflow, please reduce the belt speed. For example, now the belt speed is 500mm/min, please adjust it to about 460mm/min. Usually, reduce the speed 10% can increase the temperature about 30F. Another way is that, do not adjust the speed, and increase the temperature properly. The increase range standard is the temperature wave. Adjust the temperature on the basis difference between PCB actual and standard temperature. The adjust range is about 5℃.When adjust the temperature, it can not exceed the PCB and component bearing capacity.
5. Let the PCB board pass the reflow system in the new speed or new set temperature. If there is no reflow, back to step 4 to adjust again. Or carry out the step 6 for temperature fine-turning.
6. The heat temperature wave is adjustable according to the PCB board. You can adjust the transmission belt speed to adjust the temperature. Reduce the belt spend can increase the product heat temperature. On the contrary, you can reduce the product heat temperature.
7. Attention: if there is components on the PCB, the PCB pass the reflow and it reflow not very completely, suggest you adjust then reflow again. Usually this cannot damage the components.
8. From low to high when set temperature. If the heat range is over the reflow temperature too high, should increase the transmission speed or reduce the set temperature. The detailed operation is opposite to step 4.
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