Micro-processor controlled reflow oven, suit for various soldering of SMD/BGA automatically, easy operate;

Fast infrared and hot air heating, make temperature more accurate and evenness.

Fuzzy temperature control technology, visualization drawer, can see the whole soldering process very clearly.

It can achieve soldering of single and double-sides PCB board.

FEATURES

(1) A large infrared soldering area 

 Soldering area: 180*235mm ; this increases the usage range of this machine drastically and makes it an economical investment. 

(2) Choice of different soldering cycles  

Parameters of eight soldering cycles are predefined and the entire soldering process can completed automatically from Preheat, Soak and Reflow through to cool down. 

(3) Special heat up and temperature equalization with all designs  

Big power of energy efficient Infrared heating and air circulation to re-flow solder. 

(4) Ergonomic design, practical and easily operated  

Good build quality but at the same time light weight and a small footprint allows the T962 to be easily bench positioned transported or stored.

(5) Large number of available functions  

Solder most single or double-sides PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production.

Technical parameters                              

Soldering area: 180*235mm

Overall dimensions: 31*29*17cm

Packing dimensions: 38*24*38cm

Power: 800W

Cycle time: 1-8 min

Voltage: AC110V-AC220V /50-60HZ

Net weight: 6.2Kgs

Gross weight: 8Kgs