Specifications

TAIAN PUHUI T-962A desk reflow oven
- Use infrared heating
- Automatic soldering
- Easy operate
- CE passed

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Technical parameters     

                          

 

Soldering area: 300*320mm

 

 

Overall dimensions: 43*37*26cm

 

 

Packing dimensions: 51*45*33cm

 

 

Power: 1500W

 

 

Cycle time: 1-8 min

 

 

Voltage: AC110V-AC220V /50-60HZ

 

 

Net weight: 12.5Kgs

 

 

Gross weight: 16Kgs

 

 

 

Micro-processor controlled reflow oven, suit for various soldering of SMD/BGA automatically, easy operate; Fast infrared and hot air heating, make temperature more accurate and evenness. Fuzzy temperature control technology, visualization drawer, can see the whole soldering process very clearly. It can achieve soldering of single and double-sides PCB board.

 

 

 

FEATURES

 

 

(1) A large infrared soldering area

 

 

Soldering area:300*320mm; this increases the usage range of this machine drastically and makes it an economical investment.

 

 

(2) Choice of different soldering cycles

 

 

Parameters of eight soldering cycles are predefined and the entire soldering process can completed automatically from Preheat, Soak and Reflow through to cool down.

 

 

(3) Special heat up and temperature equalization with all designs

 

 

Big power of energy efficient Infrared heating and air circulation to re-flow solder.

 

 

(4) Ergonomic design, practical and easily operated

 

 

Good build quality but at the same time light weight and a small footprint allows the T962A to be easily bench positioned transported or stored.

 

 

(5) Large number of available functions

 

 

Solder most single or double-sides PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production.