Specifications
x-ray system designed to address the inspection needs of BGA, CSP, flip Chip, semiconductors, and multi-layer board registrationX-Ray inspection system
SAM is a high resolution x-ray system designed to address the inspection needs of BGA, CSP, flip Chip, semiconductors, and multi-layer board registration. SAM has created the HT for process development, process monitoring and ongoing support of the rework and repair function.
The SM is a "batch" or manual type of x-ray system, it includes a Windows based workstation with multiple image processing functions for real time measurement and data collection. SAM has combined ease of use, excellent image quality and low price in the development and introduction of the SM
System features
1,Up to 100 kV,130KV,5 micron ( typical ) focal spot x-ray tube producing 125X geometric magnification, plus optical zoom for an additional 600X magnification.
2, Field of view range1.5mm to 50mm (typical) (.05" to 2")
3, Laser pointer for visual correlation.
4,Zaxis control of x-ray source (FOV and magnification control).
5,Zaxis movement of x-ray detector (FOV and magnification control).
Physical Dimensions Positioning System
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X-Ray tube specifications Image intensifier Specifications
Energy: 0 - C 100 kV (80 & 100kV options) | Detector Type: 4/2" Dual Field Image intensifier |
