Many-point wave pcb solder pot

Specifications

APPLICATIONS  

This inexpensive bench-top removes or installs through-hole components on SMT boards without damage to adjacent devices. It will process ICs, including DIPs, QFPs, PGAs, connectors and odd forms without reliance on slow, labor-intensive manual methods. The Mini Wave is ideal for short-runs requiring precision and repeatability. Simple to use, the operator first sets the soldering temperature desired from 0° to 400°C covering any tin/lead or lead-free thermal requirement. The correct nozzle is then selected from the 3 that are included, with many additional custom nozzles also available. The wave is activated by an on/off switch while Z-motion wave immersion and dwell time is governed by foot switch. Component removal occurs when solder bonds are fluidized, allowing the operator to extract the component from the PCB. A replacement device can then be placed on the PCB. After prefluxing, the nozzle is positioned allowing soldering to take place.

FEATHERS  

1.  Removes and installs most through-hole devices on PCBs, without damage to adjacent surface mount components.

2.  A compact, easy-to-use, low-cost machine with fast payback realized from labor savings alone.

3.  Lead or lead-free compatibility, Temperatures adjustable to 400°C.

4.  Wave is directly controlled by manual switch; solder bath dwell time controlled by foot pedal.

5. Includes customer's choice of 3 component nozzles from a total of 24 sizes available (see "Nozzles").

SPECIFICATIONS   

1.  Power:                                       220V AC/60Hz 1.2Kw  

2.  Dimension:                                 420*400*300mm

3.  Temperature Range:                    0 to 399°C

4.  Solder Capacity:                         40kg

NOZZLES SPECIFICATIONS