Lead-free reflow oven
USD $1 - $5 /Set
Min.Order:1 Set
Shenzhen SAM Electronic Equipment Co., Ltd.
Features
1, Windows XP operation software with Chinese and English alternative.Whole system under integration control can analyze and display the failure.All production data can be saved completely and analyzed.
2, PC&Siemens PLC controlling unit with stable performance; high precision of profile repetition can avoid product loss attributed by abnormal running of the computer.
3, Unique design of the thermal convection of the heating zones from 4 sides provides high heat efficiency; hight temperature difference between 2 joins zones can avoid the temperature interference; It can shorten the temperature difference between big-size and small component and meet the soldering demand of complex PCB.
4, Forced air coolin or water cooling chiller with efficient cooling speed suits all different kinds of lead-free soldering paste.
5, Low power consumption (8-10 KWH/hour) to save the manufacture cost
6, With complete alarms system ,failures can be listed on the PC interface
Opertion System
Basing on Windows XP opertion software ,both English and Chinese versions are available.
Many functions can be achieved automatically on PC.
Conveying System
AI-alloy rail dealt with surface oxidation process ensures high intensity and little distortion.
Control System
Siemens PLC+Industrial PC ensures precise controlling unit and stabilized performance.
Rail Width
Rail width can be adjusted synchronously from 4 points ,width difference tolerance:1mm.
Air Cooling System
Forcible air cooling with low temperature complies with the demand of lead-free process.
Modularized Heaters
Modularized heaters can be removed for maintenance conveniently.
UPS Power
UPS provide backup power of the machine,and PCB will not be damaged while breaking-off or overheating.
Temperature Control System
High temperature uniformity inside the chamber provides efficient heat utilization and conduction.
Specifications
1. Quantity of heating zones: 16 (top 8 heating zones, bottom 8 heating zones )
2. Width of PCB: Max: 450mm
3. Conveyor direction: L→R (Option R→L)
4. Width of convey rail: 50~450MM
5. Fixed direction of conveyor rail: front or rear
6. Height of conveyor: 920±20MM
7. Temperature of PCB warp: ±2°C;
8. Temperature controlled precision: ±1°C;
9. Supply power: 5 wires, 3 phase, 380V
10. Start-up power: 44KW
11. Power for operation: Approx.12KW
12. Conveyor speed: 0~2000mm/min
13. Heat-up time: Approx.20min;
14. Weight: Approx 1950Kg
15. Dimensions (L×W×H): 5040×1370×1455mm;
Each machine is equipped with a set of tool kit