XBQ-BP series is made of an advanced thermal conductive pressure sensitive adhesive. XBQ-BP series provides a better way for applications requiring good adhesion strength and superior thermal conductive efficiency. XBQ-BP series is suitable to apply to electronic mechanical components assembly such as the heat sink module and LED light bar module to provide a better heat-transfer path between heat-generating components and heat sink or other cooling devices.

Features :

* Complete thickness standard is available.

* Various structures are for different applications.

* Stable and economic.

* Superior adhesion strength and thermal conductive efficiency.

Applications:

* Assembly of the heat sink and DDR-RAM module.

* Assembly of the LED light bar module and metal frame bezel.

* Die-cut piece and Laminate.