Specifications

1.Type: Insulation Tape
2.Application: High Voltage
3.Carrier: OPP
4.Adhesive Side: Single Sided
5.Use: Masking

Specifications:

 1.Type: Insulation Tape
2.Application: High Voltage
3.Carrier: OPP
4.Adhesive Side: Single Sided
5.Use: Masking

 

• Conductive Grid is buried between the two anti-static layers
• Anti-static surface both inside and outside
• Three Layer construction made to use in ESD sensitive environment
• Custom sizes are available upon request 

 

Application:

1)Mask for printed circuit boards during wave solder or solderdip process.

 

 2)Masking for some  electronic component from ESD damage,apply for notes in electronic manufacturing.

 

 

3)Applications requiring heat resistant masking,as input mounting reflow process,and the manufacturing process of all  types of electronic components.