Specifications

Ideal for FPC attachments in many areas of electronics subjected to high temperature processing and operating environments.

Carrier: N/A; Color: Transparent;

 

Adhesive Type: 0.002 in. (0.05 mm) thick high temperature acrylic adhesive

Release Liner: 0.0036 in. (0.09 mm) thick heat resistant liner;

 

Temperature Tolerance(Short Term):Adhesive: 530°F (275°C)/Liner: 500°F (260°C);

 

Temperature Tolerance(Long Term):Adhesive: 350°F (175°C)/Liner: N/A

 

Features

 

• High temperature release liner that is able to survive from a typical lead-free solder reflow process having a peak temperature up to 500°F (260°C).

• Ideal for Flexible Printed Circuit (FPC) attachments in many areas of electronics subjected to high temperature processing and operating environments.

• Releasable after lead-free solder reflow.

• High adhesion, excellent holding power and low outgas.