Product Description:

      XBQ-BP series provides the best way for applications requiring good adhesion strength and superior thermal conductive efficiency.  It is suitable to apply to electronic mechanical components assembly such as the heat sink module and LED light bar module to provide a preferential heat-transfer path between heat-generating components and the cooling devices(e.g. heat sinks,fans,heat spreaders or heat pipes).

 Provide efficient thermal transfer for a wide range of applications including bonding heat sinks, heat spreaders, ICpackages,etc

Features:

• Different thickness standards are available
• Various structures are for different applications
• Stable and Economical
• Excellent adhesion strength and thermal conductivity

Applications:

• Electronic components: IC,CPU, MOS

  LED, M/B, PS, Heat Sink, LCD-TV, NB, PC

  DDRLL Module, DVD etc