King Bali Silicone Thermal Sheet  is high-performance, thermally conductive gap filling materials,  mainly for the transmission interface between the electronic equipment and heat sink or product outer coving. Nice stickiness, flexible, good compression performance and excellent heat conductivity are designed for HC series,which make the products can discharge gas from the electronic original and heat sink, to achieve fully conforming and obviously cooling effect. Compared to common thermal conductive & insulating materials, HC series has certain stickiness which bring great convenience in the product installation processing, not easy to fall off and easy to operate. 

Specifications

Thermal Silicon Pad 
1.Thermal conductivity 1.0 W/M.K~5.0W/M.K 
2.Thickness 0.3-10mm 
4.Customized 
5.Easy to install

Features & benefits:

1.High reliability & High conductivity from 1.0W/M.K to 5W/M.K with US Standard(King Bali 9200/ King Bali 9300/ King Bali 9400/ King Bali 9500/ King Bali 9600/ King Bali 9700/ King Bali 9800/ King Bali 9900)     

2.High compressibility, soft and flexible 

3.Natural stickiness, no extra surface frontal adhesives

4.Meet with the environmental requirements of ROHS and UL94 V0

Typical applications:

Communication equipment;   Mobile equipment; LED Light; Video equipment;

Switching power supply;       Networking equipment;      

Back light model;      Household appliances;

Medical equipment;      PC server/workstations 

Application modes:

1.The filling between PCB and heat sink

2.The filling between IC and heat sink or product outer coving

3.The filling between IC and similar heatsink cooling materials

King Bali-9000  Physical properties :

Typical application:

-between the Circuit board chip and heat sink of LCD-TV
-PDP chip and IC
-between the transformer and the shell.
-between Led particle base and aluminum plate
-between PCB board and its shell
-between IC and heat sink
-laptop NB display card and network card
-between STB C and heat sink or shel