Specifications

Thermal Conductivity Bonding Glue
1.hot glue,high gel-point
2.matt,good stability
3.strong adhesive strength

  Watrproof High Thermal Conductivity Bonding Glue  

 

King Bali 1900 Bonding Glue is fixed for bonding electronic components and packing, for metal, ceramics, glass, fiber products and rigid plastic encapsulation between bongding, with excellent adhesion strength of this series can be modulated as required curing time.

Properties:

Model			1900A	1900B
	Exterior	Unit	Brown	White
Before the Vulcanization	Viscosity	pa.s	300-400	100-200
	Density	g/cm3	2.7	1.36
	Mix Ratio By Weight	/	1:1
	Completely Cure Time	H	1-2.5
	OT	min	30
After the Vulcanization	Thermal Impedance	°C-in2/W	0.09
	Hardness	Shore A	≥80
	Hot Sex Variable Temperature		>120°C
	Tensi Le Strength	kg/mm2	>200
Electrical Characteristics	Volume Resistivity	Ω.cm
	Breakdown Voltage	KV/mm	>10
	Dielectric Constant	50Hz	>4

 

 

To avoid affecting the heat -conducting and adhesiveness, please make sure that the surface of the component is clean enough and theres no such as dirt, oil or salt on it. . Well mix A in the original container before using for precipitation might appear after long time storage.

 

 

Weigh A and B exactly according to the specified ratio and then mix them well color difference exist for A and B, please mix them till color difference disappears) . Please use the mixed products in 1-2 hour(s). Over-time using leads viscosity increase. A proper amount is suggested to avoid wasting. . Thicker than 0.15mm application of the products causes lower speed of curing, lower heat conductibility and waste. . The speed of curing might be affected by seasons and temperature. Low speed in winter is possible. Heating to accelerate uring is recommended.