Automatic wave solder machine LF250 with perfect performance, complete with flux spray system, preheating, wave solder and cool modules.

LF250 adjustable dual wave solder machine series lead free process of through hole can solder printed circuit boards assembly up to 350mm width, require very little solder, the capacity of solder pot is 100KG;

IR and hot air convection preheat, preheat zone 600mm, Solder processing temperature is settable to a lead-free compatible 300°C.

As PCBs are loaded onto the adjustable wave finger conveyor, they are automatically prepped by an adjustable internal spray fluxing system which houses a precision spray nozzle assembly.An automatic finger cleaner is included.

Features

•Compact design; only 2100 mm long;

•Corrosion resistant solder pot, lead-free and lead solders, PID temperature control;

•Dual-wave system with Taiwan variable-frequency controlled motors and independent adjustment of wave crest height up to 8mm;

•Energy-saving mode with automatic board detection and timer to turn off pump motors during periods of inactivity;

•Easy, precise screw and hand-crank adjustment of solder pot up/down and in/out motion, with optional motor-drive and push-button control

•600 mm IR/hot-air convection pre-heat zone with PID temperature control

•Conveyor angle adjustment from 3°-8° to suit a variety of soldering application

•Automatic finger-cleaner with pump and recirculation system compatible with cleaners for both rosin and aqueous fluxes;

•Forced-air cooling system at conveyor output for improved solder joint quality

•One-year parts warranty

Specification: