Specifications

1.bga balling machine
2.Three independent heating zones, PLC control
3. K-sensor, close loop control
4. laser asist position

Our factory:

SHENZHEN DINGHUA TECHNOLOGY CO LTD is a manufacturer specialized in design, production and sales of BGA Rework Station, rework tools and associated equipment. We are committed to provide the most advanced equipment with high quality and timely service to our customer. As one of pioneer in this industry, we continue to improve and innovate along with the market demands by absorbing the advanced development experience abroad and adhering to our vision of ‘Professionalism, Honesty, Innovative and Responsibility.

 

 

Our service:

a. Your inquiry related to our products or prices will be replied within 24hours.
b. Be Well-trained and experienced to answer all your enquires in fluent English
c. OEM&ODM, any your request we can help you to design and put into product.
d. Distributors are offered for your unique design and some our current models
e. Protection of your sales area, ideas of design and all your private information.

 

Our Product application:

1. Laptop notebook motherboard bga rework and repair.

2. Game consoles applications such as xbox Ps3 Wii bga rework and repair

3.Large circuit board maintenance, and mobile phone motherboard such small small-sized chip 

 

DH-A4  bga balling machine  parameters:

Power supply	AC220V±10% 50/60Hz
Power	6800W
Top heater	Hot air 1200W
Bottom heater	Hot air 1200W, Infrared 4200W
Positioning	V-groove, PCB support can be adjusted in any direction and with external universal fixture
Temperature control	K type thermocouple, closed loop control, independent heating
Temp accuracy	±2°C
PCB size	Max 500*400 mm Min 22*22 mm
Workbench fine-tuning	±15mm forward/backward, ±15mm right/left
Camera magnification	10x-100x
BGA chip	2*2-80*80mm
Minimum chip spacing	0.15mm
External Temperature Sensor	1-5(optional)
Placement Accuracy	±0.01MM
Machine dimension	(L*W*H): 750*1020*1000mm
Packing dimension	(L*W*H): 110*90*110cm
NW/GW	91/116kg

 

BGA  Bga Balling Machine  DH-A4 Features:

1.Item name:DH-A4

 

 

2. The operator can supervise the process on a split screen 17” monitor.

 

3.Optical Alignment

4. colors separation, magnification, micro adjustment, auto focus, auto correction and auto color differentiation and light level adjustment system. Manually or automatically adjusting picture clarity.

 

5.the upper hot air heater ,low Infrared heater and the bottom IR heater. Preheating the PCB with infrared plates can avoid deformation and guarantees precision of soldering

 

6.Heating and placing head’s unique combined design, allows flawless placing and soldering. X,Y and Z axis are adjustable by micrometer with accuracy of up to ±0.01mm.

 

7.Rework station is the highest security equipment. Which has Password protects the datas. This screen can show the three independent heating temperature and time, and also can show 4-6 temperature profiles.

 

 

8.V-groove PCB support, rapid positioning, convenience, accuracy, can fit for all kinds of PCB board, We also have FLEXIBLE and CONVENIENT fixtures for all shapes PCB boards. which can protect and prevent well for damage to PCB board.

 

 

 

9.K sensor close control, control heating process High precisely. 

 

 

 

 10.Various sizes of BGA alloy nozzles, the min size 31*31mm,the max size is 55*55mm.which can be adjusted 360 degree for easily installation and replacement.

 

11.Use a powerful cross-flow fan to cool PCB rapidly to prevent it from deformation and ensure the welding effect.

 

12. Sound al arm hint system. There is a alarm 5-10 seconds before the completion of welding or installing to warn the workers to be prepared.

 

13.Wooden case packing

14.CE certificate and patent