Specifications

1. Semi-auto BGA Chips Repairing Machine BGA Reballing Machine
2.HD touch screen interface
3.PLC control

 

Total Power	6800W
Top heater	1200W
Bottom heater	Second heater 1200W,IR preheating 4200w
Current	20A
power	AC220V±10%     50/60Hz
Dimensions	L1022*W670*H850 mm
Packing size	900*1170*1150mm
Positioning	V-groove, PCB support can be adjusted in X,Y direction and equipped with external universal fixture
Temperature control	K Sensor, Closed loop
Temp accuracy	±1℃
PCB size	Max 500*400 mm Min 22*22 mm
Workbench fine-tuning	Forward/back±15mm, right/left±15mm
Camera magnification	10x-100x times
BGA chip	2*2-80*80mm
Minimum chip spacing	0.15mm
External Temperature Sensor	1-5(optional)
Placement Accuracy	±0.01MM
NW/GW	97kg/116kg

 

 

Features of Semi-auto BGA Chips Repairing Machine BGA Reballing Machine DH-A4 

 

1.High definition touch screen, PLC control, can save multiple group profile. Show the real-time set and measured temperature with instant temperature curve analysis function.

 

2.Power on password protect and change function, To ensure the heating effect and placement accuracy, the heating head and placement head are independent control. Adopt linear slide which makes X,Y,Z axis all can do micro adjust or rapid positioning; Instead of moving the PCB after mounting, we just need to move the upper heating head to heat directly to ensure the welding effect, placement accuracy.

 

3.Three independent heaters. Hot air upper and bottom heater. Infrared preheat bottom. Heating time, temperature and curve all can be displayed on touch screen.

 

4.K-type thermocouple (closed loop), PID parameter self-setting system automatic and temperature adjustment system with PLC, temperature precision within ±1 degree.

 

5.V-groove PCB support can be adjusted in any direction with external universal fixture,suitable for all kinds of BGA repair.

 

6.Flexible and removable universal fixture protects the PCB, prevents PCB components damage and deformation and adapt to all kinds of BGA size

 

7.Offer all kinds of hot-air nozzle, with 360degree rotation; easy to install and change, customized is available.

 

8.High-definition CCD version system, two-tune, enlarge, micro-adjustment, automatic focusing and remediation equipped with color resolution and brightness adjustment auto device and can adjust the definition auto automatic or manual.

 

9.X The X, Y axis and R angle with micrometer adjust, precise positioning, alignment accuracy within ±0.01MM. High-definition LCD monitors.

 

10.8 level up/down + 8 level constant temperature control, save multiple groups profile. We can analyze, set and calibrate the temperature parameters curve on the touch screen at any time.

 

 

11.Including Voice "early warning" function. 5-10 seconds before the completion of uninstalling or welding, voice reminder / warning to get the workers prepared. Cooling system will start automatically or manually after vertical wind stopped heating to ensure the welding effect.

 

12.Internal vacuum pump, Φ angle 60° rotation, Micrometer precision to mount suction nozzle by fine tuning without air.

 

13.CE certification, with emergency switch and automatic power-off protection device when emergency happens.

 

Structure of Semi-auto BGA Chips Repairing Machine BGA Reballing Machine DH-A4  

 

More photos of Semi-auto BGA Chips Repairing Machine BGA Reballing Machine DH-A4 

 

 

 

 Accessories of Semi-auto BGA Chips Repairing Machine BGA Reballing Machine DH-A4

1 piece user guide

-1 piece brush

 

-1 piece temperature sensor

 

- 5 pcs hot air nozzle: top nozzle 3pcs (31x31mm,38x38mm,41x41mm), Bottom nozzle 2pcs (34x34mm,55x55mm) PS: Hot air nozzle size can be customized according to your chip size

 

-1 piece vacuum pen

 

-5 pcs vacuum sucker

 

-6 pcs universal fixture

 

-6 pcs plug knob

 

-6 pcs supporting screw