Product Details

BGA rework station/BGA reballing station/Automatic BGA repair motherboard Station

Product Description

Description:

Specification:

Power supply: 110V/220V/50-60HZ
Heating Method: Two-side infrared heating
Demension: L360mm*W520mm*H430mm
Maximum Power: 2.3KW
PCB size: 405mm*310mm
Temperature Control: Method
Heating controlled independently: Yes
Upper heating control method: High-precision closed-loop control, instrument error ±0.5%
Upper temperature control and measuring method: High sensitivity temperature sensor, temperature monitoring indirectly.(monitor temperature of heater element)
Bottom heating control method: High-precision closed-loop control, instrument error ±0.5%
Bottom temperature control and measuring method: High sensitivity temperature sensor, temperature monitoring indirectly. (monitor temperature of heater element)
Rework station Function
Application type: Be suitable for welding,sealing-off or repairing BGA,PBGA,CSP on different PCB and more kinds of encapsulation mode component, all suitable for lead or lead-free soldering.
Suitable chip size: ≤50mm
Other Performances

Description:

It is with three independent temperature zones, top is dark infrared, lower is hot air heater and bottom is large infrared pre-heater. It can be easily used in leaded and lead free rework.
It is with infrared ceramic preheating system which can bake damp PCB board and chips independently and its preheating area can be adjusted according to PCB.
High-power cross-flow cooling system to accelerate the preheating zone cooling, to ensure the success rate of continuous desoldering.
Bottom hot air nozzles follow the high-tech rework station’s mature design.
Using high-tech temperature control program.
Preheating control is with optimized design to ensure the preheating temperature won’t overheat.
Dual LED light design, more convenient to observe the reworking process.