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Product Details

Specifications

1. Grade:W1 W2
2. Purity :W1 > =99.95% W2 > =99.92%
3.Melting Point: 3410 Degrees Celsius

Tungsten sheet used for producing electric light source parts,components of electric vacuum; producing W-boats,heat shield and heat bodies in high temperature furnace.

Size: 0.05-20mm ( Thickness ) x 50~450mm( Width ) x 100~800mm( Length )

1. Grade:W1 W2

2. Purity :W1 > =99.95% W2 > =99.92%

3. Characteristic:

Melting Point: 3410 Degrees Celsius

Boiling Point: 5927 Degrees Celsius

Density: 19.3g/m3

High quality, workability

4. Certificate: ISO9002

5. Product Feature: High melting point, High-density, high temperature oxidation resistance, long service life, resistance to corrosion.

6. Dimensions and tolerance(According to clients’ requirements):

Tungsten Plate [mm]
thickness	tol	width	tol	length	tol	quality	flatness in %
1.000	+/- 0.200	500.0	+/- 1.20	1000	+5/-0	hot rolled, pickled	20
1.500	+/- 0.250	500.0	+/- 1.70	1000	+5/-0	hot rolled, pickled	20
2.000	+/- 0.250	500.0	+/- 1.70	1000	+5/-0	hot rolled, pickled	25
3.000	+/- 0.300	300.0	+/- 1.70	800	+5/-0	hot rolled, pickled	25
4.000	+/- 0.200	200.0	+/- 1.70	600	+5/-0	hot rolled, pickled	25
5.000	+/- 0.200	200.0	+/- 1.70	550	+5/-0	hot rolled, pickled	25

7. Application:

1).for producing tungsten targets
2).for producing ion implantation parts
3).for rolling tungsten foil and punching tungsten discs
4).for producing electric light source parts and electric vacuum components
5).for producing heating elements and refractors in high temperature furnaces

Metals & alloys

Chromium

Hafnium

Molybdenum, Mo-Nb, Mo-Ti, Mo-W

Nickel, Ni-Cr, Ni-V

Niobium, Nb-Ti, Nb-Zr

Tantalum, Ta-W

Titanium, Ti-Al, Ti-Cr, Ti-Cu, Ti-Pd

Tungsten, W-Ag, W-Re

Zirconium, Zr-Ti

Purity: 99%-99.999%, dependant on different materials

Shape and form:

quare, rectangle, circular, triangular, rotatable

Single piece or multiple pieces construction. Jointed by butt or beveled for multi-segmented targets.

OEM design available

Surface and tolerance:

Precision fabricated and grounded. Roughness Ra 0.8-Ra 3.2 for target surface

Process:

HIP, Vacuum melting or Press-sintered. Dependant on different materials and application.

Typical application:

Flat Panel Displays, Optical Discs, Automotive & Architectural Glass, WEB Coating, Decorative, Hard Coatings, Solar Cells, Magnetic Data Storage Devices, Semiconductors, Optical Communications, Electron Microscopy