New Patent Model 

Keyland Laser Dicing Machine for Solar Wafer   

Laser power: 10W 20W Fiber Laser        

Laser Dicing machine  is suitable for cutting,scribing of solar PV industry,just like mono crystalline silicon,poly crystalline silicon solar cell,amorphous ribbon silicon and silicon wafers.

Details of  Solar Laser Dicing machine   :

  *Lucia Lv will tell you how to choose suitable model .Meanwhile, your sampls can be sent to us for testing cutting by our Laser machine   , the cutting performance will make you sure whether it is right  machine for your choose.

Our Laser Dicing machine 's Characters:

1. Imports of fiber lasers, to adapt to the environment more strong, and the better beam quality(mode TEM00) ,kerf finer,more smooth edge

2. Small size  Compact design for easy moving and handling,in line with moder business management 6s

2015 New Model:

2014 Old Version

2.High efficiency electro-optical conversion.

3.High precision and Air cooling

4.Stable and continuous processing but lower operation cost

5.Easy&convenient operation

6.Maintenance-free (no damageable parts&consumable parts be replaced)

7.Touch screen control,servo motor for option

8.Automatic absoption and without foot pedal

9.Imported Core parts

Details of   Solar Cell cutting Laser machine  :

 Scribing Cutting solar cell/wafer sample :

 Broken cell is used for Solar lamp,Sun hat,Sun toy,solar air conditioning and etc.

 Application of    Laser Dicing machine :

Our Package and shipping way

We manufacture