Product Details

Specifications

LED Sapphire UV Laser Cutting Machine For Sale
1 Fully automatic operation
2 One button work
3.high reliability

LED Sapphire UV Laser Cutting Machine For Sale

Application

Mainly used in the LED sapphire substrate wafer cutting

Technology Characters:

One button operation, fully automatic operation of the dicing process;

High precision linear motion platform, the marble pedestal bearing table, the focal length automatically adjusts the body;

Automatic positioning system of the CCD image recognition can be back cut tangent;

Anti-coarsening of the visual system;

Software to automatically identify the template, angle correction, automatic contour to find the contour correction;

High reliability, low maintenance and operating costs;

The dicing process, the software automatically correct bar code reading, production data statistics and other features.

Main Technical parameters:

Processing type
Processing type	UV cut
Optical parameters
Laser wavelength	355nm
Type of laser	Q-semiconductor solid-state lasers
Operating parameters
Repeatability of the X-Y axis	≤±0.5 um
X-Y-axis positioning accuracy	≤±0.1 um
Z-axis positioning accuracy	15 arc- sec
The X-Y axis	200mm
Z-axis	20mm
Cutting parameters:
Cut to size	2", 4"
Cutting depth	20~30um ±2um
Cutting speed	80~130mm/s
Cutting line width	8um
Other parameters
Ambient humidity	20~25 °C ± 2 °C
Absolute humidity	20%~60% ( Non-condensing)
Compressed air	0.5~0.8 Mpa
Power	220V 15A/ 50~60Hz
Dimensions	120011001600mm
Machine weight	1000kg
Degree of automation	Fully automatic
Control system	PC control