Product Details

Specifications

1. Layers: 3-layers
2. Thickness of the board: 2.0mm, 1oz copper
3. Surface finish: Immersion gold / OSP

3 Layers Immersion Gold / OSP PCB Aluminum PCB Board Multilayer For Power Supply

Specification:

Material	Aluminum
Layer count	3 layers
Board thickness	2.0mm
Copper thickness	1oz
Minimum drill size	0.3 mm
Minimum trace & gap	0.2 mm
Surface finish	Immersion gold / OSP
Applications	Power supply
Special Technology	Multilayer aluminum PCB

PCB Circuit Board

NO	ITEM	Technical capabilities
1	Layers	1-20 layers
2	Max. Board size	508×610 mm
3	Min. board Thickness	2-layer 0.12mm
		4-layer 0.4mm
		6-layer 0.6mm
		8-layer 0.90mm
		10-layer 1mm
4	Min. line Width/Space	0.127mm(4mil)
5	Max. Copper thickness	5OZ
6	Min. S/M Pitch	0.075mm(3mil)
7	Min. hole size	0.15mm(6mil)
8	Hole dia. Tolerance (PTH)	±0.05mm(2mil)
9	Hole dia. Tolerance (NPTH)	+0/-0.05mm(2mil)
10	Hole position deviation	±0.05mm(2mil)
11	Outline tolerance	±0.10mm(4mil)
12	Twist & Bent	<0.7%
13	Insulation Resistance	100MΩ Normal
14	Electric strength	>1.3kv/mm
15	S/M abrasion	>6H
16	Thermal stress	288°C 20Sec
17	Test Voltage	50-300V
18	Min. blind/buried via	0.15mm (6mil)
19	Surface Finished	HAL, ENIG, OSP, Plating AG, Plating gold,HAL tin, silver
20	Materials	FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base, CEM-3, CEM-1, Halgenfree

Applications:

Communications Traditional telecommunication equipment, FTTP, VOIP, multimedia services, data networking and IT infrastructure products, wireless infrastructure products, power amplifiers, splitters and combiners, high power transistors, etc.

Computer Peripherals High end printers, cable modem, wireless routers, IP telephones, consumer and office products, banking system etc.

Consumer Computers, televisions, cameras, digital video recorders (DVR), handheld products, LED, etc.

Automotive Passenger safety systems, engine control systems, air bags, traction control products, etc.

High End Computing and Storage High performance computer and server, mainframe system and storage equipment, memory, etc.

Industry Power supply, main control panel, monitor, CCTV products,automotive control equipment, industry robot, access control products etc

Medical Magnetic resonance imaging (MRI), computed tomography (CT), emergency response defibrillation units, patient monitoring, implantable devices, robotic surgery systems, biometrics and diagnostic equipment, etc.

Military Satellite, radar, airplane, control unit, communication equipment .etc.

Test & Measurement Power meters, electricity tester, thermal tester, light tester, network tester, gas and oil tester, infrared products, semi-conductor test equipment, DUT and probe cards, wafer inspection systems, etc.

PCB Circuit Board

NO	ITEM	Technical capabilities
1	Layers	1-20 layers
2	Max. Board size	508×610 mm
3	Min. board Thickness	2-layer 0.12mm
		4-layer 0.4mm
		6-layer 0.6mm
		8-layer 0.90mm
		10-layer 1mm
4	Min. line Width/Space	0.127mm(4mil)
5	Max. Copper thickness	5OZ
6	Min. S/M Pitch	0.075mm(3mil)
7	Min. hole size	0.15mm(6mil)
8	Hole dia. Tolerance (PTH)	±0.05mm(2mil)
9	Hole dia. Tolerance (NPTH)	+0/-0.05mm(2mil)
10	Hole position deviation	±0.05mm(2mil)
11	Outline tolerance	±0.10mm(4mil)
12	Twist & Bent	<0.7%
13	Insulation Resistance	100MΩ Normal
14	Electric strength	>1.3kv/mm
15	S/M abrasion	>6H
16	Thermal stress	288°C 20Sec
17	Test Voltage	50-300V
18	Min. blind/buried via	0.15mm (6mil)
19	Surface Finished	HAL, ENIG, OSP, Plating AG, Plating gold,HAL tin, silver
20	Materials	FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base, CEM-3, CEM-1, Halgenfree