ITEM

PRODUCTIVE CAPABILITY

Layer

1-24

Produces Type

HF(High Frequency)& buried ,blind board, Impedance controlled board ,HDI board ,BGA Thicker Copper (Up to 10 OZ)board

Material

FR4(Shengyi, ITEQ, Nanya ), Rogers, Telflon etc. aluminum,Polyimide

Finished Surface

HASL, lead-free HASL, ENIG(Immersion Gold), Immersion Tin, Immersion Silver, Hard Gold, Plating Gold, Gold Finger, OSP

Minimum Line Width/Space

3/3mil

Minimum Hole Size

0.15mm(Mechanical Drill);

0.1mm(Laser Drill)

Minimum Annular Ring

3mil

Max Copper Thickness

10 OZ 

Max Production Size

700×1200mm

Board Thickness

D/S: 0.2-7.0mm;

Multilayers:0.40-7.0mm

Plugging Vias Capability

0.2-0.8mm

Board Thickness Tolerance

Thickness less than 1.0mm:+/-0.1mm;

1.0mm--2.0mm:+/-10%;

Thickness more than 2.0mm:+/-8%

Hole Size Tolerance

PTH:+/-3mil;

NPTH:+/-2mil

Certificate

ISO9001:2008, RoHS, UL certificate, ISO14001