Product Details

high temperature ESD Polyimide Tape

Polyimide (PI) adhesive tape,Insulation material for tansformer.

Application: Polyimide (PI) adhesive tape, Insulation material for tansformer. This item is used for SMD packing and transformer manufacturing.

Specification: 1. Polyimide base film coating with high temperature Silicone adhesive;

2. High temperature and corrosion resistance;

3. Strong adhesion;

4. Soft and proper and no residue after peeling off.

5. For electronic manufacturing industry.

Backing	Polyimide	Polyimide	Polyimide	Polyimide	Polyimide	Polyimide	Polyimide	Polyimide	Polyimide
Adhesive type	Silicone	Silicone	Silicone	Silicone	Silicone	Silicone	Silicone	Silicone	Silicone
Backing Thickness(mm)	0.02	0.025	0.025	0.025	0.05	0.05	0.075	0.1	0.125
Adhesive thickness(mm)	0.025	0.025	0.035	0.045	0.03	0.05	0.045	0.05	0.055
Total Thickness(mm)	0.045	0.05	0.06	0.07	0.08	0.1	0.12	0.15	0.18
Color	amber	amber	amber	amber	amber	amber	amber	amber	amber
Adhesive strength(kg/25mm)	0.5~0.6	0.6 ~0.7	0.6~0.7	0.6~0.7	0.6~0.7	0.6~0.7	0.6~0.7	0.6~0.7	0.6~0.7
Elongation (%)	14	14	14	14	26	26	40	68	85
Corrosion resistance	1	1	1	1	1	1	1	1	1
Heat resistance(°C)	258°C	258°C	258°C	258°C	258°C	258°C	258°C	258°C	258°C
Length(m)	50	50	33	50	33	33	33	33	33
Width(mm)	2~500 according to the customers’ requirement

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