Specifications

Details

Base Material

FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont

Fil Thickness ( in inches)

0.062”, 0.080”, 0.093”, 0.125”, 0.220”, 0.047”, 0.031”, 0.020”, 0.005"

Layer count

1 to 26 Layers

IPC Class

Class II, Class III ,  Class 1

Annular Ring

5 mil/side or Greater (Min. Design)

Finish Plating

Solder(HASL), Lead Free Solder(HASL), ENIG (ELectroless Nickel Immersion Gold), OSP, Immersion Silver,Immersion Tin, Immersion Nickel, Hard Gold,  Other

Copper Weight

0.5OZ-7OZ

Trace/Space Width

 3 Mils or Greater

Drill Clearance

0.1mm(laser drilling)

Plated Slots

0.036 or Greater

Smallest Hole (Finished)

0.1mm or Greater

Gold Fingers

1 to 4 Edge (30 to 50 Micron Gold)

SMD Pitch

0.080” -  0.020” -  0.010”

Soldermask Type

LPI Glossy, LPI-Matte, SR1000

CNC Route Point

Any

Minimum Route Width

0.031”

Scoring

Straight Lines, Jump Scoring, Panel Edge to Edge, CNC*

Body Gold

HARD*, IMMERSION* (up to 50 MICRON GOLD)

Data File Format

Gerber 274x with embedder aperture

 Fab. Drawing Format

DXF, HPGL, DWG, PDF, Gerber

E.T Testing

Flying Probe, Single Sided, 1up Plate, Clampshell, Net List

Counter Sink / Counter Bore

Availiable up to 0.250 Diameter