Polyamide Hot-melt Adhesive 

Composition: ·100%

polyamide resin. 

Features:·Good adhesiveness, adheres to most surfaces with high bonding strength.

Good high and low temperature resistance, and have excellent thermal stability

Good oil –resistance and good electric insulation

Have lower viscosity at melting condition

100% solid, no pollution and toxicity.

Specially formulated for low pressure molding 

Application:It is fit to be used for the adhesion of materials like electric appliances, heat-shrinkable material, packing material, fabrics, leather, lumber, plastic, metal, ceramics, etc.

For more, please kindly contact us.Thank you.