Semiconductor Nickel Plated Stepped Lid

Stepped Lids

Stepped lids offer the ideal solution for sealing hermetic packages using a seam welding processes. They may also be specified where laser welding is employed. Stepped lids are etched to ensure tight dimensional tolerances are maintained. The chemical milling technique used for etching results in a profile ideal for seam welding and provides a part free from burrs and residual stress sometimes associated with metal stamping.

Hi-Rel has a vast range of designs on open tooling to help address your specific lid requirements. If necessary, new designs can be produced and manufactured within days of receiving a customer’s instruction.

Stepped Lid Capabilities

Nickel Plated Stepped Lid For The Commercial Market

Semiconductor devices such as transistors, crystal oscillators, MEMS, or photocells require a hermetically-sealed package to protect their reliability and functionality in high-tech electronic applications.

Our Services

Our variety of Kovar Stepped Lids:

Electrolytic Nickel

Nickel is the widest used electroplated coating with a myriad of functional and decorative applications. Bright Nickel is often used in the automotive, electrical, appliance and hardware industries with one of its most important functions being that of an undercoat for Chrome. In heavy deposits it will smooth out a base metal and offer significant corrosion protection.

Nickel is also used for engineering purposes where brightness is not a concern. Pure, unbrightened nickel is often used as a barrier coat for subsequent plated finishes. Sulfamate nickel produces a 99.9% pure nickel deposit that is minimally stressed making it an excellent choice for parts that will be flexed, bent or crimped. It is the recommended choice as an underplate for lead-frames, interconnect pins, and glass-to-metal or ceramic-to-metal seals.

Nickel also has a high melting temperature of 2647F (1452C) so it’s widely used in high temperature applications.

Specified standards are typically AMS-QQ-N-290, ASTM B689, AMS 2403, and Mil-P-27418

Electroless Nickel

Electroless Nickel is generally used as a functional coating rather than decorative. Primary uses for Electroless Nickel would be for Corrosion Resistance, Wear Resistance, Hardness, Lubricity, Uniformity of Deposit, and for the Non-Magnetic properties of high phosphorous alloys.

Unlike electroplating where electrical current is used, Electroless Nickel is plated autocatalytically. Deposition occurs in an aqueous soluton containing metal ions along with reducing and complexing agents. Chemical reactions on the surface of the work piece cause the deposition of the nickel alloy. Since there’s no electricity involved and all surfaces are in solution for the same amount of time, the deposit thickness is very uniform. Plating internal surfaces, recessed cavities, etc. becomes a reality with Electroless Nickel. Uniformity and internal coverage are many times not possible with electrolytic nickel deposits.

Specific callouts for Electroless Nickel are most often Mil-C-26074, ASTM B733, and AMS 2404

Gold Plating

Gold plating is valued for its physical properties and since it’s a noble metal it does not oxidize or chemically react under normal conditions. Pure gold has excellent electrical and thermal conductivity characteristics and is a primary choice when electrical conductivity, soldering, and corrosion resistance are design requirements.

Pure soft gold is 99.9% pure with a Knoop hardness of less than 90. Typical uses are for wire bonding, die attach, and high reliability soldering applications. Specification callouts are generally ASTM B488, Type III, Code A and Mil-G-45204, Type III, Grade A.

Hard gold is typically 99.0-99.7% pure with an alloying agent of either nickel or cobalt and has a Knoop hardness of 130-200. Hard golds are generally used where electrical conductivity (especially low current) is necessary and if repeated sliding or connection wear are of concern. Spec callouts for Hard Gold are often ASTM B488, Type II, Code C or Mil-G-45204, Type II, Grade C.

Custom Designs:

FNSE specializes in the design and manufacture of custom Caps. Our engineers are always ready to assist you in designing the most efficient and economical sensor and micro circuit packages to fit your requirements.

Full CAD/CAM Services:

With several CAD/CAM designers on staff, FNSE can take your sketch, blueprint, or Other design and turn it into a precision CAD drawing. Have your own CAD/CAM file for your part? Our experienced engineers will review your design and make sure that when it is finally sent to our computer controlled machines, your part will be produced accurately.

FNSE is a full-service metal forming and manufacturing company.

Company Information

Sanjin Electronics have 18-year experiences in OEM manufacturing Ceramics Packages; TO Metal Caps; CerDIP Lead frames and all kinds of Microelectronics Packaging Covers/Lids(Kovar Flat lids and Kovar Stepped Lids), etc. Our company qualification ensures our products with ISO9000, ISO14000 and SGS certificate to meet your stringent quality requirements. Also, we have successful cases in Russia, Germany, USA, and so on. Our value is Serve Every Client Heart and Soul!