Specifications

1. custom design flexible printed circuit
2. flexible printed circuit 8 layers
3. double sided flexible circuit

  flexible printed circuit specifications: 

 

 

   Layers: 1-2 layers (flexible)
  Thick bottom material: 25, 50, 75, 100um, 1 / 2, 1, 2, 3mil
  Thick copper conductor: 18, 35, 70um, 1 / 2, 1, 2oz
  Material: polyester and polyimide
  Copper: RA, ED
  Minimum aperture: 0.2mm
  Minimum spacing: 0.1mm
  The smallest ring porous: 0.1mm
  The largest panel size: 400 x 400mm
  Plating: welding, nickel, gold
  Volume Resistance aluminum: 1 x 1015 (IPC-TM-650 2.5.6.17)
  Dissipation factor (1MHz): 0.04 (MIL-P55617)
  Solder heat resistance: 300 degrees C/10 seconds
  Strength: 5kV (IPC-TM-650 2.5.6.1)
  Insulation Resistance: 1,000 mW (IPC-TM-650: 2, 6, 3, 2)

  

 

Primary Competitive Advantages:
1. Prompt Delivery
2. Quality Control (IQC, On line Inspection, OQC, ISO9001 and 5S)
3. Reputation
4. Service
5. Small Orders Accepted
6. Superior R&D Background (continuously new product development and current product improvement)
7. Customize Design / Production (OEM/ODM business and flexible designs for customers' special requirements)

 

 

 

Shenzhen Lunfeng Technology Co., Ltd. is a manufacturer engaged in the production, sale, and service of Flexible Printed Circuit.