Metallized Ceramic Rings & Ceramic Metallization & For Electronics industry

Metallized Ceramic Rings & Ceramic Metallization & For Electronics industry

USD $1 - $50 /Parcel

Min.Order:10 Parcels

Supply Ability:
1000000 Piece / Pieces per Month
Port:
Shenzhen
Payment Terms:
T/T

Quick Details View All >

Place of Origin:
Guangdong, China
Type:
Ceramic Rings
Application:
Industrial Ceramic
Material:
Alumina Ceramic
Model Number:
ceramic metallization
Brand Name:
HXP

Shenzhen Huaxin Precision Ceramics Co., Ltd.

Business Type: Manufacturer,Trading Company
Shenzhen Guangdong China
Main Products: Steatite Ceramic Part ,95% Alumina Ceramic Tube ,Zirconia Ceramic Rod ,99% AL2O3 Ceramic Shaft ,Industrial Ceramic Component

Product Details

Specifications

Ceramic Metallization Ceramic Rings
-Good insulation performance
-High temperature application
-High power
-Customized

 

Product Description

 

 

Metallized Ceramic Rings & Ceramic Metallization & For Electronics industry

Metallized Ceramics for vacuum interrupters

Metallized Ceramics for electrical and electronic devices

Metallized ceramic brazed components

Provide solutions for high reliability vacuum-tight joints with extreme bond strength. Metallized ceramics are commonly used in many applications, for example in power electronics components placed under extreme load, electrical drive engineering and electrical engineering as well as in electronic components for computer

technology. We makes hermetic ceramic-to-metal joints possible with extremely high bond strengths exceeding 200 N/mm².

 

Applications:

Electrical transmission and distribution

Electronics industry

Textile machinery

Defense

Medical electronics

Automobile industry

Avionics

Solid Oxide Fuel Cells

White goods

High power/High temperature application

We can supply the products according to customer's drawings, samples and performance requirement.

metallized ceramics for vacuum interrupters,metallized ceramics for electrical and electronic devices, ceramic brazed components, ceramic metallizing, welding ceramic part

Property chart for metallization

No.

Item

Index

1

Thickness of metal layer

 

Mo-Mn, 8μm Min

Ni: 2μm Min

2

Bonding strength

>650N/cm2

3

Solderability

Temperature for soldering tin: 235±5°C dip time lasts 5 second, fresh, glossy and connective solder covered on more than 95% area of bonding pad.

 

4

Resistance of solderability

 

Temperature for soldering tin: 260±5°C dip time lasts 20 seconds, fresh, glossy and connective solder covered on more than 95% area of bonding pad.

 

 

 

 

Packaging & Shipping

 Metallized Ceramic Rings & Ceramic Metallization & For Electronics industry

 

Our Services

 Metallized Ceramic Rings & Ceramic Metallization & For Electronics industry

 

FAQ

 Metallized Ceramic Rings & Ceramic Metallization & For Electronics industry

 

Company Information

 Metallized Ceramic Rings & Ceramic Metallization & For Electronics industryMetallized Ceramic Rings & Ceramic Metallization & For Electronics industry

 

 

 

 

Contact Supplier

Mr. Tom Tu Manager Chat Now
Telephone
0086-0755-28532196
Mobile
13530216316
Fax
0086-0755-28520997
Address
B2205, Buji Center Square, Buji Town, Longgang District, Shenzhen, China 518112 Shenzhen,Guangdong

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