GS-RMB5020 wireless module MT7623
GS-RMB5020 wireless module MT7623

GS-RMB5020 wireless module MT7623

USD $8 - $20 /Piece

Min.Order:500 Pieces

Supply Ability:
3000 Piece / Pieces per Month
Port:
shenzhen
Payment Terms:
T/T Credit Card

Quick Details View All >

Place of Origin:
China
Brand Name:
Oolite
Model Number:
GS-RMB5020

Shenzhen Gainstrong Technology Co., Ltd.

Business Type: Manufacturer
Shenzhen Guangdong China
Main Products: openwrt device ,WIFI ODM ,WIFI OEM

Product Details

GS-RMB5020 Module

 

1. General

The GS-RMD5020-V1.0  module use the MT7623A chipset.The  Mediatek MT723A is a highly  integrated

network router  system-on-chip used for  high wireless performance,  home entertainment, home  automation and

so on.

MT7623A is fabricated  with advanced silicon process  and integrates a  Quad-core ARM® Cortex-A7 MPCoreTM

operating up to  1.3GHz and more DRAM  bandwidth. This SoC also includes  a variety of peripherals,including

MIPI, RGMII, PCIe2.0,  USB2.0 OTG ,USB3.0  ports, and 5-port GbE  switch. To support popular network

applications, MT7623A  also implements 10/100/1000  Ethernet RGMII interface,  embedded a 5-ports  Giga switch

and supports 802.11ac/n  WLAN connection thru  its PCIe port.

Besides the connectivity  features, the hardware-based  NAT engine with QoS embedded  in MT7623A transporting

the audio/video  streams in higher priority  than other non-timely services  also enriches the home  entertainment

application. The SFQ separating  P2P sessions from audio/video  ones so that MT7623A guarantees the streaming

service.

With the advanced  technology and abundant  features, GS-RMD5020-V1.0  module is well positioned  to be the

core of next-generation  Smart WiFi AP router, and home  gateway systems.

Features

  Embedded Quad-core  ARM® Cortex-A7 MPCore  operating at 1.3GHz

--32KB L1 I-Cache  and 32KB L1 D-Cache

--512KB unified L2  Cache

-- NEON/FPU

-- DVFS technology

 32-bit

DDR3/L

   eMMC4.5

   USB3.0 Host x  2 (2nd port share w/ PCIe2.0)

   USB2.0 OTG x  1

   PCIe2.0 Host x  3 (3 nd port share w/ USB3.0)

  SPI, I2C, UART Lite,  JTAG, MDC, MDIO, GPIO, PWM,  ADC

    VoIP support (I2S, PCM)

    Audio interface (I2S, PCM)

  Deliver the super  Samba performance via  USB2.0/USB3.0/SD-XC

    One RGMII/MII  interface

    Gigabit Switch

     --5 ports with full-line  rate

--5-port 10/100/1000Mbps  MDI transceivers

  HW storage accelerator

     --HW NAT

    --2Gbps wired speed

    --L2 bridge

    --IPv4 routing,  NAT, NAPT

--IPv6 routing, DS-Lite,  6RD, 6to4 HW

   HW QoS

--16 hardware queues  to guarantee the min/max  bandwidth of each  flow

    --Seamlessly co-work  with HW NAT engine

--2Gbps wired speed

--SFQ w/ 1k queues

 HW Crypto Engine

-- Deliver 1 Gbps IPSec  throughput

-- AES/3DES, MD5/SHA1/SHA2

 

 


 Precautions before surface  mounting:

1.When customers Open stencil must be sure the hole bigger to the

module plate, please press 1 to 1 and 0.7 mm is widened to open

outward, the thickness of 0.12 mm.

2.Can't get the wifi module bare hands when needs,must we wear

the gloves and static ring.

3.The furnace temperature according to the size of the customer the

mainboard ,generally like to stick on a tablet standard temperature

of 250 + - 5,can do 260 + - 5.

Storage  and  use  module  control  should  pay  attention  to the

following matters:

1.Module of the storage life of vacuum packaging

1-1.Storage  life    12  months.  Storage  conditions:<40    .  Relative

humidity:<90%R.H.

1-2.After  this  bag  is  opened  ,  devices  that  will  be  subjected  to

infrared reflow, vapor-phase reflow, or equivalent processing must

be :

1-3.Check

the

humidity

card

:stored

at

20%RH.If   :30%~40%(pink)or   greater  than   40%(red).Labeling

module has moisture absorption.

Mounthed  within   168  hours   at  factory  conditions   of:

t

30%

60%R.H.

Once  opened, the workshop  the preservation of   life  for

168 hours.

1-4.If baking is required,devices may be baked for:

Modules must be to remove module moisture problem.

Baking temperature: 125

, 8 hours.

After  baking,  put  proper  amount  of   desiccant  to  seal

packages.

2.Module packaging items as follows.

2-1.Storage  life    12  months.  Storage  conditions:<40    .  Relative

humidity:<90%R.H.

2-2.Module apart packing after 168 hours

To launch patch need to

bake,  to   remove  the  module   hygroscopic,  baking   temperature

conditions

125

8hours.

 





  


  

 

Contact Supplier

Mr. Trigg Shaw Sales Manager Chat Now
Telephone
86-755-81720165
Mobile
13760295917
Fax
86-755-27259359
Address
3nd Floor, 1st building, E block, MinZhu Western Industry Park, Shajing, Baoan Dist., Shenzhen, Guangdong, China Shenzhen,Guangdong

You May Like

New Products

Recommended Products

View More View Less

Find Similar Products By Category

Telecommunications > Communication Equipment > Wireless Networking Equipment
Categories
Hi~