Product Details

BGA Rework Station All Smart Cell Phone Motherboard Repairing Machine BGA Rework Station

Product Description

Features:

Basic Parameters
Dimension	L360mm x W360mm x H460mm
Total weight	About 12 kg, vary with the different need of the users
Electrical Parameters
Power	220V AC
Upper Heating	Hot Air
Consumption of upper heating	450W
Bottom Heating	Hot Air
Consumption of Bottom heating	450W
General power	900W
Temperature Control Monitor the target temperature
Control mode of Upper	PLC up to 500 degree
Control mode of Bottom	PLC up to 500 degree
Rework Function
SMD	Suit for welding, remove or repair packaged devices such as BGA,PBGA,CSP,multi-layer substrates, EMI metallic shield product and solder/lead free Rework welding
Size of applicable PCB	≤97mm x200mm

Function Show:

Packaging & Shipping

Payment & shipment:

1.We accept TT, Western Union and Money Gram.

2.Shipment:by Express (UPS,DHL.FEDEX.EMS), by air, by sea

3.We accept your shipping agent.