Specifications
High viscosity thermal silicon gap filler-Heatsink thermal pads
-ROHS & UL listed
-Industry direct price
-Adhesive LED type
The HCB(SCB) series High viscosity thermal silicon gap filler type is adhesive thermal conductive silicon pad, mainly for the thermal conductivity between the heating device and the heat sink or the product outer covings without fastening devices.
Features & benefits:
1.Ultra-stickiness
2.Without fastening devices
3.Electrically isolating
4.Meet with the environmental requirements of ROHS and UL
Typical applications:
1.LED light
2.Power conversion equipment
3.Between the semiconductor or magnetic body and heat sink
4.HID ballast
5.Household appliances
Physical properties:
Test item | Test method | Unit | HCB150 Test value | SCB150 Test value |
Color | Visual |
| Grey | Grey |
Thickness | ASTM D374 | Mm | 0.5 to 10.0 | 0.5 to 1.5 |
Specific Gravity | ASTM D792 | g/cc | 1.8±0.1 | 1.6±0.1 |
Hardness | ASTM D2240 | Shore C | 18±5 to 40±5 | 70±5 |
Tensile Strength | ASTM D412 | kg/cm2 | 8 | 8 |
ASTM D412 | Pa | 5.88*109 | 5.88*109 | |
Continuous Use Temp | EN 344 | °C | -40 to +220 | -40 to +220 |
Volume Resistivity | ASTM D257 | Ω-CM | 1.0*1011 | 1.0*1011 |
Breakdown Voltage | ASTM D149 | KV/mm | 4 | 4 |
Flame Rating | UL-94 |
| V-0 | V-0 |
Conductivity | ASTM D5470 | w/m-k | 1.5 | 1.5 |
Configurations available: 200mm*400mm, 300mm*300mm, specific size could be provided according to your requirements.
