They are formed by coating a layer of very thin release agent evenly on single side or double side. The surface of release membrane is smooth and clean with even coating having no defects of folds, particles, bubbles, pinholes and etc.

The product physical properties are excellent with minor thickness tolerance and low thermal shrinkage, mainly used for top quality separating material during processing treatment for epoxy PCB with high tensile strength and tear strength.

Used for separating adhesive materials which is widely applied for the fields of electronics, mobile phone, adhesive agent, PCB and etc. Product thickness: 0.025MM~0.188MM.

It is suitable for thermal transfer printing and also more suitable for die-cutting pad, adhesive product stamping and etc. Release force can be controlled with high glossiness and cleanness having residual adhesive strength of 94% and good surface property.

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